Freelance AI & 3D engineer · available for new projects

LLM chatbots, 3D reconstruction and custom AI tools — built to ship.

Shopsmon is a one-person engineering studio. You describe the problem; I design, build and hand over working software: LLM agents that answer real questions, 3D pipelines that turn photos into geometry, and focused AI tools for your workflow.

What I build

Three focused services. Each starts with a short scoping chat and a fixed-scope quote before any work begins.

LLM

Chatbot & agent development

Support bots, internal knowledge assistants and tool-using agents with retrieval over your own documents.

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3D

3D reconstruction

Multi-view geometry, photogrammetry-style pipelines, camera calibration and point-cloud processing in Python.

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Tools

Custom AI tools

Automations and small apps: document extraction, classification, data cleaning, dashboards — scoped to your workflow.

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How a project works

Simple, transparent, low-risk.

Scope

Tell me your goal, inputs, outputs and deadline. I reply with questions and a fixed-scope proposal.

Build & demo

You see a working demo early, so you can judge the direction before committing to the full build.

Deliver

Full source, documentation and a handover call. Payment via PayPal invoice.

Latest tech news

AI, LLM, chip and smartphone headlines, with sources. See all →

AI & LLM · 2026-11-03

DeepMind: an AI agent compresses a drug-design iteration to about an hour

Google DeepMind introduced "Cheminformatics Skills" for Google Antigravity. On real lung-cancer drug data, the agent searches thousands of compounds, runs matched molecular pair analysis (MMPA) and proposes novel macrocycles with synthetic routes in about an hour — a loop that typically takes several days. DeepMind itself cautions that the designs are testable hypotheses that must still be synthesised and validated experimentally.

Source: Google DeepMind

Computer systems & chips · 2026-11-03

Qualcomm validates first HBC silicon: 18x memory bandwidth over LPDDR

According to Futurum, Qualcomm has validated its High Bandwidth Compute (HBC) technology in the lab: a two-layer stacked-DRAM sample bonded to a compute die measured 18x the bandwidth of LPDDR and 5x the bandwidth per watt of HBM4. Qualcomm did not disclose the workload, model or precision, so this is a component-kernel result rather than end-to-end inference. The Dragonfly AI250, the first HBC platform, is due to sample to customers in the first half of 2027.

Source: Futurum Group

Computer systems & chips · 2026-11-03

Nordic nRF71: Wi-Fi, Bluetooth LE, Thread and edge AI on one chip, up to 20x lower standby power

Nordic Semiconductor announced the nRF71 SoC series (nRF7120 with dual-band Wi-Fi 6, nRF7120E adding tri-band Wi-Fi 6E). The company says standby power is up to 20x lower than the current nRF70 series, and the integrated Axon NPU runs ML models 10–17x faster than the 256 MHz Cortex-M33 alone — enough for keyword spotting, anomaly detection and image classification on battery-powered devices. Figures are the manufacturer's; the chips are sampling.

Source: Nordic Semiconductor

Computer science & data · 2026-11-02

KAIST: CluSTER cuts LLM fine-tuning time by up to 69.6% with nearly the same quality

Professor Jae-Gil Lee's team at KAIST proposes CluSTER, which groups and selects data with similar learning effect and spreads it evenly over multiple GPUs to reduce repeated learning. On ~7B and 13B models, three coding/medical datasets and eight benchmarks, models kept nearly the same performance with only about 31% of the data while training time dropped by up to 69.6% (10 hours to about 3). Experiments were mainly on 4 GPUs; presented at EMNLP 2026.

Source: KAIST

Have a project in mind?

Send two or three sentences about what you need. You will get a reply with questions and a proposal.